Set of 2: 10cc RMA223 Flux Solder Paste for Repairing Solder Joints in Electronics

Product Overview

• Condition: 100% Brand New
• Type: RMA-223
• Features high joint strength and excellent immersion properties
• Dimensions: 95 x 35 mm
• Volume: 10cc

Product Details

RMA-223 is a moderately active rosin-based soldering paste, ideal for SMD repair processes on mobile phone circuit boards. This wash-free soldering paste is characterized by its light color and high Surface Insulation Resistance (SIR).

• Recommended for BGA, CSP, and other ball matrix solder joint repairs.
• Each package comes with a booster needle for easy application.

Performance Characteristics

• Delivers good insulation and a smooth soldering surface.
• Remains stable without degradation or drying out.
• Ensures good immersion and strong joints, and is safe for use as it is non-toxic and non-corrosive.